System BGA RE-7500



  • Medium & large scale service centers

  • Mobile electronics and communications systems devices

  • Cellular, PDA s, Handhelds, PC motherboards

  • LAN devices, network nodes and military equipment

  • Portable medical equipment

  • Anything and everything SMD








    Features

  • The RE-7500 can be used to remove and reflow all SMD components, including BGA, CBGA, CCBA, CSP, QFN, MLF, PGA, epoxy underfilled uBGA's, and more.

  • Recommended for reworking all plastic parts including PTH, sockets, and connectors - all without any damage to the plastic parts.

  • Complete rework process including pre-heating, soaking, reflowing and cooling stages are all achieved with this breakthrough technology, insuring accurate and standardized results.

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